Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
1～15 item / All 99 items
It is an all-in-one selective flow system for small-batch production that performs "prefluxing," "preheating," and "soldering" all in one machine.
You can choose from inline type or cell production type based on production processes, introduction costs, space, etc. All models are equipped with a dot fraxer, solder feeding feeder, and monitoring camera.
Exhibiting at Internepcon! Introducing new products that accommodate large-scale products. <Sample testing now available>
The vacuum soldering device removes voids in the solder by melting the solder in a vacuum. By performing preheating in a hydrogen atmosphere or formic acid atmosphere, it achieves flux-free soldering. It boasts the number one domestic track record as a standard machine in the power device manufacturing process. With the adoption of an upper lamp heater specification, it can accommodate large products and irregular substrates, including heavy items. [Exhibition Information] We will exhibit at Internepcon 2023. A panel of this device and samples of large products will be displayed. (Exhibition dates: January 25 (Wed) to January 27 (Fri) at Tokyo Big Sight, Booth Number: East Hall 1, 2-34) *For detailed specifications, please download the PDF. Feel free to contact us.
Accurate temperature control is possible! A local jet soldering device with excellent operability and safety.
The "Point Solder" is a device for locally soldering the leads of DIP components and others. By adopting a CPU digital system, it enables precise temperature control. It features a nozzle lever lock mechanism, making nozzle replacement easy and safe. The operation combines usability and safety, allowing for customizable jet flow times with a jet flow timer. 【Features】 ■ Significant reduction in work time due to standby function ■ Free power supply of AC100, 115, 230V (terminal block switching) ■ Solder tank/heater made of corrosion-resistant SUS316 ■ Equipped with a large front fender to prevent solder splatter ■ Designed with a solder tank unit system for interchangeability and maintainability *For more details, please download the catalog or contact us.
All stages operate simultaneously! To prevent temperature drop, we will wait in front of the preheating zone!
We would like to introduce our "Inline Selective" product. By using barcode and two-dimensional code management, or automatic stage change through substrate layout image recognition, along with the same frame jig for transportation, mixed production of a wide variety of small lots is possible. We offer a lineup that includes the one-frame types "EQS-350SDDD" and "EQSS-350SD+M," as well as the modular type "SELBO II." 【Features】 ■ Mixed production for small lots and a wide variety ■ All stages operate simultaneously ■ Tact balance can be set ■ To prevent temperature drop, it waits before the preheating zone *For more details, please refer to the PDF document or feel free to contact us.
With the all-in-one CCD camera (OP) teaching, it is easy to create soldering programs even for large substrates!
The "ULTIMA-NEO-L" is a standalone device that performs both flux application and soldering in one unit. With reliable solder contact to leads and patterns through point jet flow and optimal soldering conditions for each component, it achieves stable quality (such as T/H up). By upgrading from the standard 16kg solder capacity tank to the optional 32kg tank, a wider area corner nozzle can be used, allowing for reduced cycle times through extensive soldering, enabling nozzle selection according to application needs. 【Features】 ■ Long-selling device compatible with L-size PCBs ■ Standalone device that performs both flux application and soldering in one unit ■ Equipped with a touch panel and PC for easy and clear operation ■ By using the optional teaching function, all processes from scanning PCB data to creating flux application and soldering data can be completed within the device *For more details, please refer to the PDF document or feel free to contact us.
![[July 10th - 11th] Notice of Participation in the "Implementation and Assembly Process Technology Exhibition"](https://image.mono.ipros.com/public/product/image/2f5/2000852576/IPROS74182593440765993185.png?w=280&h=280)
Specialized in post-process automation! Introducing new equipment aimed at labor-saving for major domestic equipment manufacturers.
We will be exhibiting at the "Implementation and Assembly Process Technology Exhibition 2024" held at the Nagoya City Small and Medium Enterprise Promotion Hall. This exhibition specializes in post-process automation and will showcase new equipment aimed at labor-saving solutions from major domestic equipment manufacturers. We sincerely look forward to your visit. 【Event Overview (Excerpt)】 ■ Dates: July 10 (Wednesday) - July 11 (Thursday), 2024 ■ Hours: 10:00 AM - 5:00 PM *Last admission at 4:00 PM ■ Admission Fee: Free - General visitors: No registration required for factory representatives from manufacturing industries or equipment/product users (please submit 2 business cards at the reception) - Trading companies: Pre-registration is required *For more details, please refer to the PDF document or feel free to contact us.
Production management (traceability) supports quality control! Introducing our soldering equipment.
The EQSS-350SD is a space-saving inline model point soldering device. By adding an expansion unit to the "solder pot module," production efficiency is improved. The adoption of a two-dimensional code enhances the automatic changeover system and mixed production capabilities, improving production operating rates. 【Features】 ■ By setting the maximum substrate size of 350mm horizontally, the length of the spray and preheating dip device is reduced to 1600mm (excluding the feeder conveyor) for space-saving. ■ The addition of an expansion unit to the "solder pot module" improves production efficiency. ■ The use of a two-dimensional code enhances the automatic changeover system and mixed production capabilities, improving production operating rates. ■ Production management (traceability) supports quality control. *For more details, please refer to the PDF materials or feel free to contact us.
The dome cover is removable! It reduces solder droplet generation and suppresses solder hole formation with its jet mechanism.
The "GFL-350N" is a lead-free nitrogen soldering device with an open dome structure that does not have a curtain, accommodating component heights of up to 100mm. It supports model switching and traceability through two-dimensional codes and other means. The nitrogen dome is equipped with a mist collection and clean substrate cooling mechanism. 【Features】 ■ Open dome structure without a curtain, accommodating component heights of up to 100mm ■ Stable low oxygen concentration with a dome internal pressure adjustment structure at the entrance and exit ■ Jet flow mechanism that reduces solder dross generation and suppresses solder hole occurrence ■ The warpage prevention unit for the solder bath section operates externally without opening the dome (optional) *For more details, please refer to the PDF document or feel free to contact us.
Improving productivity of pallet dips! Enhancing through-hole ups of "low Ag solder."
The "SOFR-400" is an overflow-type automatic soldering machine that allows for the selection of four DIP methods. The production method can be chosen between inline compatibility and cell production compatibility (return back). In the peel-back DIP method, four electric cylinders are used, allowing for peel-back at angles of up to 4 degrees. 【Features】 ■ Four DIP methods can be selected ■ N2 supply is conducted simultaneously from four locations: the substrate transport section and the side of the solder tank, creating an N2 curtain that covers the solder surface ■ The production method can be chosen between inline compatibility and cell production compatibility (return back) ■ Compact design achieves space-saving *For more details, please refer to the PDF materials or feel free to contact us.
Not just a showroom, but launching an "experimental lab"! Seven manufacturers are exhibiting.
The collaborative project "MUSUBI," which hosts the Implementation and Assembly Process Technology Exhibition, has established an "experimental lab" in the Kansai region, not just a showroom, with seven equipment manufacturers. We invite you to bring your circuit boards to the lab and conduct verifications and experiments using the manufacturers' products. 【Hiroki Tech Showroom Equipment】 ■ Desktop Point Jet Soldering Device ■ Desktop Point Flux Application Device ■ All-in-One Point Jet Soldering Device *For more details, please refer to the PDF materials or feel free to contact us.
Exhibiting new equipment at Tokyo Big Sight! A reflow oven that significantly extends the frequency of in-furnace cleaning and a selective soldering machine with new features, among others.
Koki Tech Co., Ltd. will be exhibiting at the "38th Internepcon Japan Electronics Manufacturing and Packaging Exhibition" held at Tokyo Big Sight. The exhibition will take place over three days from January 24 (Wednesday) to January 26 (Friday), 2024, and our booth will be located at "East 1E4-48." We will showcase equipment such as the far-infrared combined hot air circulation reflow oven "VFR-408N" and the inline selective soldering machine "SELBOIII." 【Event Overview】 ■ Date: January 24 (Wednesday) to January 26 (Friday), 2024 ■ Venue: Tokyo Big Sight ■ Booth Number: East 1E4-48 *For more details, please refer to the PDF document or feel free to contact us.
Achieve labor-saving and automation with inline systems! Layout changes are possible with a modular configuration.
The "SELBOIII Series" is an inline selective soldering device that can add modules according to production volume. It improves soldering quality and reduces solder defects. Additionally, the optional substrate warpage correction function prevents nozzle contact. It also features various functions such as an air jet nozzle and a selective soldering bath. 【Features】 ■Improves soldering quality and reduces solder defects ■Supports labor-saving and automation in an inline format ■Can add modules according to production volume ■Layout changes possible with modular configuration ■Non-stop maintenance system (optional) *For more details, please refer to the PDF document or feel free to contact us.
We plan to exhibit a total of six devices, including selective soldering equipment and a doctor palette!
Koki Tech Co., Ltd. will be exhibiting at the "39th NEPCON Japan Electronics Development and Manufacturing Expo" held at Tokyo Big Sight. We plan to showcase a total of six pieces of equipment, including the "VFR-408N," which reduces flux cleaning, and the innovatively designed "ULTIMA-TRZ." We look forward to your visit. 【Exhibition Overview】 ■ Exhibition: 39th NEPCON Japan Electronics Development and Manufacturing Expo ■ Date: January 22 (Wed) - 24 (Fri), 2025, 10:00 - 17:00 ■ Location: Tokyo Big Sight, East Hall 1 ■ Booth Number: East 1E4-2 ■ Admission Fee: Free (Pre-registration required) *For more details, please download the PDF or feel free to contact us.
The pursuit of customer satisfaction leads to new technological innovations! Hiroki Tech products are born from a accumulation of cutting-edge technology.
This catalog introduces the products handled by Koki Tech Co., Ltd. It features various products such as "SpROBO," which applies flux efficiently under optimal conditions, and "NEO-L," which integrates a spray fluxer and solder pot into one unit. Details about each product's specifications and features are included, so please make use of this information when selecting products. [Contents] ■ Selective Soldering Series (Desktop/All-in-One) ■ Selective Soldering Series (Inline) ■ Wave Soldering Series ■ Far Infrared Combined Hot Air Circulation Reflow Oven VFR Series ■ Other Lineup ■ Peripheral Equipment *For more details, please download the PDF or feel free to contact us.
Area productivity increased by 15%! Maintaining substrate compatibility with a maximum size of 380×460 allows for diverse production.
The "ULTIMA-NEO-L Smart" is a selective soldering device that has achieved miniaturization compared to the conventional model NEO-L. The reduction in size has led to a 10% decrease in power consumption. The spray and solder pot have been consolidated into one unit, improving convenience. Additionally, easy data creation is possible (anyone can do it). It can be equipped with the new feature "Preheating Unit IPH" (optional). 【Specifications (excerpt)】 ■ Device dimensions: 1150(L)×1250(W)×1050(H)mm ■ Board size: 50(W)×50(L) to 380(W)×460(L)mm ■ Maximum board weight: 2kg ■ Component height: Upper 50mm, Lower 25mm (or less) ■ Air supply volume: 0.4-0.5MPa 50L/min *For more details, please download the PDF or feel free to contact us.
